BS EN 60749-15-2003 半导体器件.机械和气候试验方法.通孔安装设备的耐钎焊温度
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Resistancetosolderingtemperatureforthrough-holemounteddevices
【原文标准名称】:半导体器件.机械和气候试验方法.通孔安装设备的耐钎焊温度
【标准号】:BSEN60749-15-2003
【标准状态】:作废
【国别】:英国
【发布日期】:2003-06-19
【实施或试行日期】:2003-06-19
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:耐钎焊温度;环境试验;半导体器件;电学测量;电子工程;气候;机械试验;电子设备及元件;元部件;气候试验;电气工程;试验;半导体;集成电路
【英文主题词】:Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Solderingtemperatureresistance;Testing;Trough-holemounting
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardmanufacturingoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:10P.;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.通孔安装设备的耐钎焊温度
【标准号】:BSEN60749-15-2003
【标准状态】:作废
【国别】:英国
【发布日期】:2003-06-19
【实施或试行日期】:2003-06-19
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:耐钎焊温度;环境试验;半导体器件;电学测量;电子工程;气候;机械试验;电子设备及元件;元部件;气候试验;电气工程;试验;半导体;集成电路
【英文主题词】:Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Solderingtemperatureresistance;Testing;Trough-holemounting
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardmanufacturingoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:10P.;A4
【正文语种】:英语
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